Multi-stage Process Analysis and Modelling based Online Monitoring for Chip Packaging Process
نویسندگان
چکیده
منابع مشابه
Underflow Process for Direct-Chip-Attachment Packaging
-In flip-chip packaging an underfill mixture is placed into the chip-to-substrate standoff created by the array of solder bumps, using a capillary flow process. The underfill mixture is densely filled with solid silica particles to achieve the desired effective coefficient of thermal expansion. Thus during the flow process the underfill mixture is a dense suspension of solid particles in a liqu...
متن کاملPetri net-based process monitoring: a workflow management system for process modelling and monitoring
Nowadays business process management is becoming a fundamental piece in many industrial processes. To manage the evolution and the interactions of the business actions it is important to accurately model the steps to follow and the resources needed by a process. Workflows provide a way of describing the order of execution and the dependencies between the constituting activities of business proc...
متن کاملResiduals based process capability indices for two-stage processes
The manufacturing operations often involve multistage processes where the process capability of each stage is affected by the process capability of its precedent processes. This property is known as the cascade property. The purpose of this paper is to estimate the process capability of the second stage of two-stage process while the cascade property impact is removed using residuals analysis. ...
متن کاملPlasma for Underfill Process in Flip Chip Packaging
Driven by the fast growing demand for smaller, faster, and higher I/O electronic devices, flip chip technology has attracted significant attention in the electronic packaging industry. Flip chip is a proven packaging technology due to its high performance, reduced form factor, and greater I/O density. In successful flip chip packaging, the underfill process plays an important role because it ca...
متن کاملA Statistical Method for Sequential Images – Based Process Monitoring
Today, with the growth of technology, monitoring processes by the use of video and satellite sensors have been more expanded, due to their rich and valuable information. Recently, some researchers have used sequential images for image defect detection because a single image is not sufficient for process monitoring. In this paper, by adding the time dimension to the image-based process monitorin...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: IFAC-PapersOnLine
سال: 2015
ISSN: 2405-8963
DOI: 10.1016/j.ifacol.2015.12.260